Ball Grid Array Joint Inspection Using X-ray as it relates to voids and the IPC-7095A specification
Submitted by admin on Sat, 2007-05-26 16:33
http://cp.literature.agilent.com/litweb/pdf/5989-5663EN.pdf
With the introduction of Leadfree solder, voiding within Ball Grid Array (BGA) joints is potentially a major issue during Printed Circuit Board Assembly (PCBA) manufacture. With BGA components sometimes costing hundreds or even thousands of US Dollars, there has to be an understanding about when voiding within the joint is excessive.